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  1 sp3220e/eb/eu +3.0v to +5.5v rs-232 driver/receiver pair the sp3220e devices are rs-232 driver/receiver solutions intended for portable or hand-held applications such as palmtop computers, instrumentation and consumer products. these devices incorporate a high-efciency, charge-pump power supply that allows the sp3220e devices to deliver true rs-232 performance from a single power supply ranging from +3.0v to +5.0v. this charge pump requires only 0.1f capacitors in 3.3v operation. the esd toler - ance of the these devices are over +/-15kv for both human body model and iec61000-4-2 air discharge test methods. all devices have a low-power shutdown mode where the driver outputs and charge pumps are disabled. during shutdown, the supply current falls to less than 1a. features meets all eia/tia-232-f standards from a +3.0v to +5.5v power supply ? interoperable with rs-232 and v.28 at +2.7v supports high serial data rates: ? 120kbps sp3220e ? 250kbps sp3220eb ? 1mbps sp3220eu 1a low power shutdown mode footprint compatible with max3221e, isl3221 4 x 1.0f external charge pump capacitors improved esd specifcations: + 15kv human body model + 15kv iec61000-4-2 air discharge + 8kv iec61000-4-2 contact discharge description selection table now available in lead free packaging v- 1 2 3 4 13 14 15 16 5 6 7 12 11 10 c1+ v+ c1- c2+ c2- r1in gnd v cc t1out no connect 8 9 sp3220 e/eb/eu t1in no connect r1out en shdn 02'(/ 3rzhu supplies rs-232 drivers rs-232 receivers external components shutdown data rate sp3220e +3.0v to +5.5v 1 1 4 capacitors yes 120kbps sp3220eb +3.0v to +5.5v 1 1 4 capacitors yes 250kbps sp3220eu +3.0v to +5.5v 1 1 4 capacitors yes 1mbps exar corporation 48720 kato road, fremont ca, 94538 ? 510-668-7017 ? www.exar.com sp3220e_eb_eu_102_102016
2 note 1 : v+ and v- can have maximum magnitudes of 7v, but their absolute diference cannot exceed 13v. these are stress ratings only and functional operation of the device at these ratings or any other above those indicated in the operation sections of the specifcations below is not implied. exposure to absolute maximum rating conditions for extended periods of time may afect reliability and cause permanent damage to the device. v cc .......................................................-0.3v to +6.0v v+ (note 1).......................................-0.3v to +7.0v v- (note 1)........................................+0.3v to -7.0v v+ + |v-| (note 1)...........................................+13v i cc (dc v cc or gnd current)......................... + 100ma input voltages txin, en, shdn...........................-0.3v to vcc + 0.3v rxin................................................................... + 25v output voltages txout............................................................. + 13.2v rxout, .......................................-0.3v to (v cc +0.3v) short-circuit duration txout....................................................continuous storage temperature......................-65c to +150c unless otherwise noted, the following specifcations apply for v cc = +3.0v to +5.5v with t amb = t min to t max . typical values apply at vcc = +3.3v or +5.0v and t amb = 25 o c, c1 - c4 = 0.1f. power dissipation per package 16-pin ssop (derate 9.69mw/ o c above +70 o c)...............775mw 16-pin tssop (derate 10.5mw/ o c above +70 o c)..............840mw electrical characteristics parameter min. typ. max. units conditions dc characteristics supply current 0.3 1.0 ma no load, v cc = 3.3v, t amb = 25 o c, txin = gnd or v cc shutdown supply current 1.0 10 a shdn = gnd, v cc = 3.3v, t amb = 25 o c, txin = vcc or gnd logic inputs and receiver outputs input logic threshold low gnd 0.8 v txin, en, shdn, note 2 input logic threshold high 2.0 v vcc = 3.3v, note 2 input logic threshold high 2.4 v vcc = 5.0v, note 2 input leakage current + 0.01 + 1.0 a txin, en, shdn, t amb = +25 o c, v in = 0v to v cc output leakage current + 0.05 + 10 a receivers disabled, v out = 0v to v cc output voltage low 0.4 v i out = 1.6ma output voltage high v cc -0.6 v cc -0.1 v i out = -1.0ma driver outputs output voltage swing + 5.0 + 5.4 v driver output loaded with 3k? to gnd, t amb = +25 o c absolute maximum ratings note 2: driver input hysteresis is typically 250mv. exar corporation 48720 kato road, fremont ca, 94538 ? 510-668-7017 ? www.exar.com sp3220e_eb_eu_102_102016
3 unless otherwise noted, the following specifcations apply for v cc = +3.0v to +5.5v with t amb = t min to t max , typical values apply at v cc = +3.3v or +5.0v and t amb = 25 c. electrical characteristics parameter min. typ. max. units conditions driver outputs (continued) output resistance 300 ? v cc = v+ = v- = 0v, t out = + 2v output short-circuit current + 35 + 60 ma v out = 0v output leakage current + 25 a v out = + 12v, v cc = gnd to 5.5v, drivers disabled receiver inputs input voltage range -15 +15 v input threshold low 0.6 1.2 v vcc = 3.3v input threshold low 0.8 1.5 v vcc = 5.0v input threshold high 1.5 2.4 v vcc = 3.3v input threshold high 1.8 2.4 v vcc = 5.0v input hysteresis 0.3 v input resistance 3 5 7 k? timing characteristics data rate sp3220e 120 235 kbps r l = 3k?, c l = 1000pf data rate sp3220eb 250 kbps r l = 3k?, c l = 1000pf data rate sp3220eu 1000 kbps r l = 3k?, c l = 250pf receiver propagation delay, t phl 0.15 s receiver input to receiver output, c l = 150pf receiver propagation delay, t plh 0.15 s receiver input to receiver output, c l = 150pf receiver output enable time 200 ns receiver output disable time 200 ns driver skew 100 ns | t phl - t plh |, t amb = 25 c receiver skew 50 ns | t phl - t plh | transition-region slew rate 30 v/s vcc = 3.3v, r l = 3k?, t amb = 25 c, measurements taken from -3.0v to +3.0v or +3.0v to -3.0v (sp3220e and sp3220eb) transition-region slew rate 90 v/s vcc = 3.3v, r l = 3k?, t amb = 25 c, measurements taken from -3.0v to +3.0v or +3.0v to -3.0v (sp3220eu) exar corporation 48720 kato road, fremont ca, 94538 ? 510-668-7017 ? www.exar.com sp3220e_eb_eu_102_102016
4 unless otherwise noted, the following performance characteristics apply for v cc = +3.3v, 250kbps data rate, all drivers loaded with 3k?, 0.1f charge pump capacitors, and t amb = +25 c. figure 2. transmitter output voltage vs load capacitance for the sp3220eb. figure 1. icc vs load capacitance for the sp3220eb. 30 25 20 15 10 5 0 icc (ma) load capacitance (pf) 0 1000 2000 3000 4000 5000 125kbps 20kbps 60kbps t1 at full data rate t2 at 1/16 full data rate t 1+t2 loaded with 3k/cload )ljxuh7udqvplwwhu2xwsxw9rowdjhyv6xsso\ 9rowdjhiruwkh63(% typical performance characteristics 6 4 2 0 -2 -4 -6 0 1000 2000 3000 4000 5000 txout + txout - transmitter output voltage (v) load capacitance (pf) t1 at 250kbps 2.7 3 3.5 4 4.5 5 supply v oltage (v) t ransmitter output v oltage (v) 6 4 2 0 -2 -4 -6 txout + txout - figure 4. supply current vs supply voltage for the sp3220eb. 12 10 8 6 4 2 0 2.7 3 3.5 4 4.5 5 supply current (ma) supply voltage (v) t1 loaded with 3k // 1000pf @ 250kbps )ljxuh6ohz5dwhyv/rdg&dsdflwdqfhiruwkh 63(% )ljxuh6xsso\&xuuhqwyv6xsso\9rowdjhiruwkh 63(8 25 20 15 10 5 0 0 500 1000 2000 3000 4000 5000 slew rate (v/ s) load capacitance (pf) - slew + slew 40 30 20 10 0 0 250 500 1000 2000 3000 4000 icc (ma) load capacitance (pf) 500kbps 1mbps 2mbps exar corporation 48720 kato road, fremont ca, 94538 ? 510-668-7017 ? www.exar.com sp3220e_eb_eu_102_102016
5 unless otherwise noted, the following performance characteristics apply for v cc = +3.3v, 250kbps data rate, all drivers loaded with 3k?, 0.1f charge pump capacitors, and t amb = +25 c. typical performance characteristics: continued 0 250 500 1000 1500 2000 load capacitance (pf) t ransmitter output v oltage (v) 6 4 2 0 -2 -4 -6 2mbps 1.5mbps 1mbps 2mbps 1.5mbps 1mbps 2.5 2.7 3 3.5 4 4.5 5 supply v oltage (v) t ransmitter output v oltage (v) 6 4 2 0 -2 -4 -6 txout + txout - 16 14 12 10 8 6 4 2 0 2.7 3 3.5 4 4.5 5 supply current (ma) supply voltage (v) t1 loaded with 3k // 1000pf @1mbps figure 7. transmitter output voltage vs load capacitance for the sp3220eu. figure 8. transmitter output voltage vs supply voltage for the sp3220eu. figure 9. supply current vs supply voltage for the sp3220eu. exar corporation 48720 kato road, fremont ca, 94538 ? 510-668-7017 ? www.exar.com sp3220e_eb_eu_102_102016
6 table 1. device pin description name function pin number en receiver enable. apply logic low for normal operation. apply logic high to disable the receiver outputs (high-z state) 1 c1+ positive terminal of the voltage doubler charge-pump capacitor 2 v+ +5.5v output generated by the charge pump 3 c1- negative terminal of the voltage doubler charge-pump capacitor 4 c2+ positive terminal of the inverting charge-pump capacitor 5 c2- negative terminal of the inverting charge-pump capacitor 6 v- -5.5v output generated by the charge pump 7 r 1 in rs-232 receiver input 8 r 1 out ttl/cmos receiver output 9 t 1 in ttl/cmos driver input 11 t 1 out rs-232 driver output. 13 gnd ground 14 v cc +3.0v to +5.5v supply voltage 15 shdn shutdown control input. drive high for normal device operation. drive low to shutdown the drivers (high-z output) and the on- board power supply 16 n.c. no connect 10, 12 pin function exar corporation 48720 kato road, fremont ca, 94538 ? 510-668-7017 ? www.exar.com sp3220e_eb_eu_102_102016
7 figure 10. pinout confgurations for the sp3220e/eb/eu v- 1 2 3 4 13 14 15 16 5 6 7 12 11 10 c1+ v+ c1- c2+ c2- r1in gnd v cc t1out no connect 8 9 sp3220 e/eb/eu t1in no connect r1out en shdn pinout exar corporation 48720 kato road, fremont ca, 94538 ? 510-668-7017 ? www.exar.com sp3220e_eb_eu_102_102016
8 figure 11. sp3220e/eb/eu typical operating circuit sp3220 2 4 6 5 3 7 15 gnd t1in t1out c1+ c1- c2+ c2- v+ v- v cc 11 0.1f 0.1 0.1 + c2 c5 c1 + + *c3 c4 + + 0.1 0.1 13 rs-232 outputs rs-232 inputs logic inputs v cc 14 5k r1in r1out 9 8 logic outputs *can be retur ned to either v cc or gnd en 1 shdn 16 f f f f e/eb/eu typical operating circuits exar corporation 48720 kato road, fremont ca, 94538 ? 510-668-7017 ? www.exar.com sp3220e_eb_eu_102_102016
9 the sp3220e/eb/eu devices meet the eia/tia-232 and itu-t v.28/v.24 commu - nication protocols and can be implemented in battery-powered, portable, or hand-held applications such as notebook or palmtop computers. the sp3220e/eb/eu devices feature exar's proprietary on-board charge pump circuitry that generates 5.5v for rs- 232 voltage levels from a single +3.0v to +5.5v power supply. this series is ideal for +3.3v-only systems, mixed +3.3v to +5.5v systems, or +5.0v-only systems that require true rs-232 performance. the sp3220eb device has a driver that can operate at a data rate of 250kbps fully loaded. the sp3220eu can operate at 1000kbps; the sp3220e device can operate at a typical data rate of 235kbps when fully loaded. the sp3220e/eb/eu is a 1-driver/1- receiver device ideal for portable or hand-held ap - plications. the sp3220e/eb/eu features a 1a shutdown mode that reduces power consumption and extends battery life in por - table systems. its receivers remain active in shutdown mode, allowing external devices such as modems to be monitored using only 1a supply current. theory of operation the sp3220e/eb/eu series is made up of three basic circuit blocks: 1. driver 2. receiver 3. the exar proprietary charge pump driver the driver is an inverting level transmitter that converts ttl or cmos logic levels to + 5.0v eia/tia-232 levels with an inverted sense relative to the input logic levels. typically, the rs-232 output voltage swing is + 5.5v with no load and at least + 5v minimum fully loaded. the driver outputs are protected against infnite short-circuits to ground with - out degradation in reliability. driver outputs will meet eia/tia-562 levels of +/-3.7v with supply voltages as low as 2.7v. the sp3220eb driver can guarantee a data rate of 250kbps fully loaded with 3k? in parallel with 1000pf, ensuring compatibility with pc-to-pc communication software. the sp3220eu driver can guarantee a data rate of 1000kbps fully loaded with 3k? in parallel with 250pf. the slew rate of the sp3220e and sp3220eb outputs are internally limited to a maximum of 30v/s in order to meet the eia standards (eia rs-232d 2.1.7, paragraph 5). the transition of the loaded output from high to low also meet the monotonicity requirements of the standard. the slew rate of the sp3220eu is not limited. this allows it to transmit at much faster data rates. figure 12 shows a loopback test circuit used to test the rs-232 driver. figure 13 shows the test results of the loopback circuit with the sp3220eb driver active at 250kbps with rs-232 load in parallel with a 1000pf capacitor. figure 14 shows the test results where the sp3220eu driver was active at 1000kbps and loaded with an rs-232 receiver in parallel with 250pf ca - pacitors. a solid rs-232 data transmission rate of 250kbps provides compatibility with many designs in personal computer periph - erals and lan applications. the sp3220e/eb/eu driver's output stage is turned of (tri-state) when the device is in shutdown mode. when the power is of, the sp3220e/eb/eu device permits the outputs to be driven up to +/-12v. the driver's inputs do not have pull-up resistors. designers should connect unused inputs to vcc or gnd. in the shutdown mode, the supply current falls to less than 1a, where shdn = low. when the sp3220e/eb/eu device is shut down, the device's driver output is disabled description exar corporation 48720 kato road, fremont ca, 94538 ? 510-668-7017 ? www.exar.com sp3220e_eb_eu_102_102016
10 (tri-stated) and the charge pump is turned of with v+ pulled down to vcc and v- pulled to gnd. the time required to exit shutdown is typically 100ms. connect shdn to vcc if the shutdown mode is not used. shdn has no efect on rxout. note that the driver is enabled only when the magnitude of v- ex - ceeds approximately 3v. receiver the receiver converts eia/tia-232 levels to ttl or cmos logic output levels. the receiver has an inverting high-impedance output. this receiver output (rxout) is at high-impedance when the enable control en = high. in the shutdown mode, the receiver can be active or inactive. en has no efect on txout. the truth table logic of the sp3220e/eb/eu driver and receiver outputs can be found in table 2. table 2. sp3220e/eb/eu truth table logic for shutdown and enable control figure 12. sp3220e/eb/eu driver loopback test circuit since receiver input is usually from a trans - mission line where long cable lengths and system interference can degrade the signal, the inputs have a typical hysteresis margin of 300mv. this ensures that the receiver is virtually immune to noisy transmission lines. should an input be left unconnected, an internal 5k? pull-down resistor to ground will commit the output of the receiver to a high state. figure 14. sp3220eu loopback test results at 1mbps figure 13. sp3220eb loopback test results at 250kbps sp3220 e/eb/eu gnd txin txout c1+ c1- c2+ c2- v+ v- v cc 0.1f 0.1 0.1 + c2 c5 c1 + + c3 c4 + + 0.1 0.1 logic inputs v cc 5k rxin rxout logic outputs en *shdn (sp3220eu 250pf) (sp3220e/eb 1000pf) v cc f f f f 6+'1 (1 7[287 5[287 t t tri-state active 0 1 tri-state tri-state 1 0 active active 1 1 active tri-state description exar corporation 48720 kato road, fremont ca, 94538 ? 510-668-7017 ? www.exar.com sp3220e_eb_eu_102_102016
11 charge pump the charge pump is an exar-patended design (u.s. 5,306,954) and uses a unique approach compared to older less-efcient designs. the charge pump still requires four external capacitors, but uses a four-phase voltage shifting technique to attain sym - metrical 5.5v power supplies. the internal power supply consists of a regulated dual charge pump that provides output voltages of +/-5.5v regardless of the input voltage (vcc) over the +3.0v to +5.5v range. in most circumstances, decoupling the power supply can be achieved adequately using a 0.1f bypass capacitor at c5 (refer to fgures 6 and 7). in applications that are sensitive to power-supply noise, decouple vcc to ground with a capacitor of the same value as charge-pump capacitor c1. physi - cally connect bypass capacitor as close to the ic as possible. the charge pump operates in a discontinu - ous mode using an internal oscillator. if the output voltages are less than a magnitude of 5.5v, the charge pump is enabled. if the output voltages exceed a magnitude of 5.5v, the charge pump is disabled. this oscillator controls the four phases of the voltage shift - ing. a description of each phase follows. phase 1 v ss charge storage during this phase of the clock cycle, the positive side of capaci - tors c 1 and c 2 are initially charged to v cc . c l + is then switched to gnd and the charge in c 1 C is transferred to c 2 C . since c 2 + is con - nected to v cc , the voltage potential across capacitor c 2 is now 2 times v cc . phase 2 v ss transfer phase two of the clock connects the negative terminal of c 2 to the v ss storage capacitor and the positive terminal of c 2 to gnd. this transfers a negative gener - ated voltage to c 3 . this generated voltage is regulated to a minimum voltage of -5.5v. simultaneous with the transfer of the volt - age to c 3 , the positive side of capacitor c 1 is switched to v cc and the negative side is connected to gnd. phase 3 v dd charge storage the third phase of the clock is identical to the frst phase the charge transferred in c 1 produces Cv cc in the negative terminal of c 1 , which is applied to the negative side of capacitor c 2 . since c 2 + is at v cc , the voltage potential across c 2 is 2 times v cc . phase 4 v dd transfer the fourth phase of the clock connects the negative terminal of c 2 to gnd, and transfers this positive generated voltage across c 2 to c 4 , the v dd storage capacitor. this voltage is regulated to +5.5v. at this voltage, the in - ternal oscillator is disabled. simultaneous with the transfer of the voltage to c 4 , the positive side of capacitor c 1 is switched to v cc and the negative side is con - nected to gnd, allowing the charge pump cycle to begin again. the charge pump cycle will continue as long as the operational conditions for the internal oscillator are present. since both v + and v C are separately gener - ated from v cc , in a noCload condition v + and v C will be symmetrical. older charge pump approaches that generate v C from v + will show a decrease in the magnitude of v C compared to v + due to the inherent inefciencies in the design. description exar corporation 48720 kato road, fremont ca, 94538 ? 510-668-7017 ? www.exar.com sp3220e_eb_eu_102_102016
12 description charge pump design guidelines the charge pump operates with 0.1f ca - pacitors for 3.3v operation. for other supply voltages, see the table for required capacitor values. do not use values smaller than those listed. increasing the capacitor values (e.g., by doubling in value) reduces ripple on the transmitter outputs and may slightly reduce power consumption. c2, c3, and c4 may be increased without changing c1s value. minimum recommended charge pump capacitor value input voltage vcc charge pump capacitor value for sp3220e/eb/eu 3.0v to 3.6v c1 - c4 = 0.1f 3.0v to 5.5v c1 - c4 = 0.22f the charge pump oscillator typically operates at greater than 250khz allowing the pump to run efciently with small 0.1f capacitors. efcient operation depends on rapidly charg - ing and discharging c1 and c2, therefore capacitors should be mounted close to the ic and have low esr (equivalent series resistance). low cost surface mount ceramic capacitors (such as are widely used for power-supply decoupling) are ideal for use on the charge pump. however the charge pumps are de - signed to be able to function properly with a wide range of capacitor styles and values. if polarized capacitors are used the positive and negative terminals should be connected as shown in the typical operating circuit. voltage potential across any of the capaci - tors will never exceed 2 x vcc. therefore capacitors with working voltages as low as 6.3v rating may be used with a 3.0v vcc supply. the reference terminal of the v+ capacitor may be connected either to vcc or ground, but if connected to ground a minimum 10v working voltage is required. higher working voltages and/or capacitance values may be advised if operating at higher vcc or to provide greater stability as the capacitors age. under lightly loaded conditions the intelligent pump oscillator maximizes efciency by running only as needed to maintain v+ and v-. since interface transceivers often spend much of their time at idle this power-efcient innovation can greatly reduce total power consumption. this improvement is made possible by the independent phase sequence of the exar charge-pump design. exar corporation 48720 kato road, fremont ca, 94538 ? 510-668-7017 ? www.exar.com sp3220e_eb_eu_102_102016
13 figure 16. charge pump phase 2 v cc = +5v v ss storage capacitor v dd storage capacito r c 1 c 2 c 3 c 4 + + ++ ? ? ? ? -5.5v v cc = +5v ?5v ?5v +5v v ss storage capacitor v dd storage capacitor c 1 c 2 c 3 c 4 + + ++ ? ? ? ? )ljxuh&kdujh3xps23kdvh )ljxuh&kdujh3xps23kdvh v cc = +5v ?5v ?5v +5v v ss storage capacitor v dd storage capacitor c 1 c 2 c 3 c 4 + + ++ ? ? ? ? )ljxuh&kdujh3xps23kdvh v cc = +5v v ss storage capacitor v dd storage capacito r c 1 c 2 c 3 c 4 + + ++ ? ? ? ? +5.5v )ljxuh&kdujh3xps:dyhirupv ch1 2.00v ch2 2.00v m 1.00 s ch1 5.48v 2 1 t t [] t +6v a) c 2+ b) c 2 - gnd gnd -6v description exar corporation 48720 kato road, fremont ca, 94538 ? 510-668-7017 ? www.exar.com sp3220e_eb_eu_102_102016
14 esd tolerance the sp3220e/eb/eu device incorpo - rates ruggedized esd cells on all driver output and receiver input pins. the esd structure is improved over our previous family for more rugged applications and environments sensitive to electro-static discharges and associated transients. the improved esd tolerance is at least + 15kv without damage nor latch-up. there are diferent methods of esd testing applied: a) mil-std-883, method 3015.7 b) iec61000-4-2 air-discharge c) iec61000-4-2 direct contact the human body model has been the generally accepted esd testing method for semi-conductors. this method is also specifed in mil-std-883, method 3015.7 for esd testing. the premise of this esd test is to simulate the human bodys potential to store electro-static energy and discharge it to an integrated circuit. the simulation is performed by using a test model as shown in figure 20. this method will test the ics capability to withstand an esd transient during normal handling such as in manu - facturing areas where the ic's tend to be handled frequently. the iec-61000-4-2, formerly iec801-2, is generally used for testing esd on equipment and systems. for system manufacturers, they must guarantee a certain amount of esd protection since the system itself is exposed to the outside environment and human pres - ence. the premise with iec61000-4-2 is that the system is required to withstand an amount of static electricity when esd is applied to points and surfaces of the equipment that are accessible to personnel during normal usage. the transceiver ic receives most of the esd current when the esd source is applied to the connector pins. the test circuit for iec61000-4-2 is shown on figure 21. there are two methods within iec61000-4-2, the air discharge method and the contact discharge method. with the air discharge method, an esd voltage is applied to the equipment under test (eut) through air. this simulates an electrically charged person ready to connect a cable onto the rear of the system only to fnd an unpleasant zap just before the person touches the back panel. the high energy potential on the person discharges through an arcing path to the rear panel of the system before he or she even touches the system. this energy, whether discharged directly or through air, is predominantly a function of the discharge current rather than the discharge voltage. variables with an air discharge such as approach speed of the object carrying the esd potential to the system and humidity will tend to change the discharge current. for example, the rise time of the discharge current varies with the approach speed. the contact discharge method applies the esd current directly to the eut. this method was devised to reduce the unpredictability of the esd arc. the discharge current rise time is constant since the energy is directly transferred without the air-gap arc. in situ - ations such as hand held systems, the esd charge can be directly discharged to the figure 20. esd test circuit for human body model r c device under test dc power source c s r s sw1 sw2 description exar corporation 48720 kato road, fremont ca, 94538 ? 510-668-7017 ? www.exar.com sp3220e_eb_eu_102_102016
15 device pin human body iec61000-4-2 tested model air discharge direct contact level driver outputs + 15kv + 15kv + 8kv 4 receiver inputs + 15kv + 15kv + 8kv 4 equipment from a person already holding the equipment. the current is transferred on to the keypad or the serial port of the equipment directly and then travels through the pcb and fnally to the ic. the circuit models in figures 20 and 21 rep - resent the typical esd testing circuit used for all three methods. the c s is initially charged with the dc power supply when the frst switch (sw1) is on. now that the capacitor is charged, the second switch (sw2) is on while sw1 switches of. the voltage stored in the capacitor is then applied through r s , the current limiting resistor, onto the device under test (dut). in esd tests, the sw2 switch is pulsed so that the device under test receives a duration of voltage. for the human body model, the current limiting resistor (r s ) and the source capacitor (c s ) are 1.5k? an 100pf, respectively. for iec-61000-4-2, the current limiting resistor (r s ) and the source capacitor (c s ) are 330? an 150pf, respectively . figure 22. esd test waveform for iec61000-4-2 figure 21. esd test circuit for iec61000-4-2 table 3. transceiver esd tolerance levels r s and r v add up to 330 for iec61000-4-2. r c device under test dc power source c s r s sw1 sw2 r v contact-discharge model t = 0ns t = 30ns 0a 15a 30a i t 7khkljkhu& s value and lower r s value in the iec61000-4-2 model are more stringent than the human body model. the larger storage capacitor injects a higher voltage to the test point when sw2 is switched on. the lower current limiting resistor increases the current charge onto the test point. description exar corporation 48720 kato road, fremont ca, 94538 ? 510-668-7017 ? www.exar.com sp3220e_eb_eu_102_102016
16 package: 16 pin ssop exar corporation 48720 kato road, fremont ca, 94538 ? 510-668-7017 ? www.exar.com sp3220e_eb_eu_102_102016
17 package: 16 pin tssop exar corporation 48720 kato road, fremont ca, 94538 ? 510-668-7017 ? www.exar.com sp3220e_eb_eu_102_102016
18 ordering information (1) part number operating temperature range lead-free package package method sp3220ebca-l/tr 0c to 70c yes (2) ssop tape and reel sp3220ebcy-l/tr 0c to 70c tssop tape and reel sp3220ebcy-l 0c to 70c tssop rail sp3220ebea-l/tr -40c to 85c ssop tape and reel sp3220ebea-l -40c to 85c ssop rail sp3220ebey-l/tr -40c to 85c tssop tape and reel sp3220ebey-l -40c to 85c tssop rail sp3220eca-l/tr 0c to 70c ssop tape and reel sp3220eca-l 0c to 70c ssop rail SP3220ECY-L/tr 0c to 70c tssop tape and reel SP3220ECY-L 0c to 70c tssop rail sp3220eea-l/tr -40c to 85c ssop tape and reel sp3220eea-l -40c to 85c ssop rail sp3220eey-l/tr -40c to 85c tssop tape and reel sp3220eey-l -40c to 85c tssop rail sp3220euey-l/tr -40c to 85c tssop tape and reel notes: 1. refer to www.exar.com/sp3220e , www.exar.com/sp3220eb , www.exar.com/sp3220eu for the most up-to-date ordering information. 2. visit www.exar.com for additional information on environmental rating. exar corporation 48720 kato road, fremont ca, 94538 ? 510-668-7017 ? www.exar.com sp3220e_eb_eu_102_102016
19 revision history notice exar corporation reserves the right to make changes to any products contained in this publication in order to improve design, performance or reli - ability. exar corporation assumes no representation that the circuits are free of patent infringement. charts and schedules contained herein are only for illustration purposes and may vary depending upon a user's specifc application. while the information in this publication has been carefully checked; no responsibility, however, is assumed for inaccuracies. exar corporation does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause failure of the life support system or to signifcantly afect its safety or efectiveness. products are not authorized for use in such applications unless exar corporation receives, in writing, assurances to its satisfaction that: (a) the risk of injury or damage has been minimized ; (b) the user assumes all such risks; (c) potential liability of exar corporation is adequately protected under the circumstances. copyright 2012-16 exar corporation datasheet october 2016 for technical questions please email exar's serial technical support group at: serialtechsupport@exar.com reproduction, in part or whole, without the prior written consent of exar corporation is prohibited. date revision description 08/30/05 -- legacy sipex datasheet 02/02/11 1.0.0 convert to exar format and update ordering information. 06/03/11 1.0.1 remove sp3220euca-l(/tr) and sp3220euea-l(/tr) per pdn 110510-01 10/20/16 1.0.2 update input voltage range of receiver from +/-25v to +/-15v, update ordering information table, remove wsoic package information exar corporation 48720 kato road, fremont ca, 94538 ? 510-668-7017 ? www.exar.com sp3220e_eb_eu_102_102016
mouser electronics authorized distributor click to view pricing, inventory, delivery & lifecycle information: exar: ? SP3220ECY-L? sp3220ebey-l? sp3220eca-l? sp3220ebcy-l? sp3220eea-l? sp3220eey-l? sp3220euey-l/tr ? sp3220eucy-l? sp3220euey-l? sp3220eucy-l/tr? sp3220eca-l/tr? sp3220eea-l/tr? sp3220ebea-l? sp3220ebea-l/tr? sp3220ebca-l? sp3220ebca-l/tr? sp3220ebey-l/tr? sp3220eey-l/tr? sp3220ebcy-l/tr ? SP3220ECY-L/tr


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